Thermal Engineer

Thermal Engineer – Front-End I/O Active Thermal SolutionsPosition Overview

We are seeking a highly motivated Thermal Engineer to join our Front-End I/O Active Thermal Solutions team. This role is responsible for developing and optimizing active thermal management solutions for high-speed interconnect systems. The ideal candidate will collaborate closely with customers to define boundary conditions, perform thermal simulations, validate designs through lab testing, and deliver optimized, production-ready thermal solutions that meet performance, reliability, and manufacturability requirements.

Key Responsibilities

• Customer Collaboration

• Engage directly with customers to gather thermal boundary conditions, system-level constraints, and performance requirements.
• Translate customer needs into actionable simulation and test plans.

• Thermal Simulation and Analysis

• Develop and execute thermal models using CFD tools (e.g., ANSYS Icepak, FloTHERM, or equivalent).
• Analyze airflow, temperature distribution, and heat dissipation for active thermal solutions in high-density front-end I/O environments.
• Perform sensitivity and optimization studies to ensure thermal performance meets design goals.

• Experimental Validation

• Work with lab teams to plan and conduct thermal testing and validation.
• Correlate experimental data with simulation results to refine and validate models.
• Identify and troubleshoot thermal design issues through root-cause analysis and iterative testing.

• Optimization and Reporting

• Optimize designs based on simulation and test results to balance performance, cost, and manufacturability.
• Prepare detailed technical reports summarizing analysis, findings, and recommendations.
• Present results and optimized solutions to customers and cross-functional teams.

Qualifications

**Education & Experience:**

• Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or a related field.

• 3+ years of experience in thermal design or analysis for electronic systems or interconnect hardware preferred.

**Technical Skills:**

• Proficiency with CFD tools (ANSYS Icepak, FloTHERM, or equivalent).

• Experience with thermal instrumentation and data acquisition (thermocouples, IR cameras, etc.).

• Familiarity with CAD software (SolidWorks, Creo, or similar).

• Strong understanding of heat transfer, fluid dynamics, and electronic packaging.

**Soft Skills:**

• Excellent problem-solving and analytical skills.

• Strong communication and presentation abilities for customer interaction and reporting.

• Ability to manage multiple projects in a fast-paced environment.

Preferred Qualifications

• Experience developing thermal solutions for high-speed connectors, modules, or front-panel I/O systems.

• Background in active cooling technologies (fans, blowers, heat pipes, vapor chambers, etc.).

• Understanding of electrical and mechanical design trade-offs in system integration.

• Experience with Design of Experiments (DOE) or statistical optimization methods.

Why Join Us

• Work on cutting-edge interconnect technologies driving next-generation data centers and high-performance computing.

• Collaborate with multidisciplinary teams in a global engineering environment.

• Opportunity to innovate and directly influence customer product performance and reliability.